Using an RF link rather than the common mechanical-electrical connection between the card antenna and the module, improves the robustness of the payment card and simplifies card design and ...

Infineon Technologies AG has introduced its new 'Coil on Module' chip package for Dual Interface bank and credit cards, which are used for both contact-based and contactless applications. The new ...

The passport includes a polycarbonate (PC) data page with an integrated security chip, which is embedded in a contactless module based on reliable CoM technology. The data page contains sensitive ...

The Flip Chip technology, coupled with a radio frequency link rather than a physical link, is a product innovation that responds perfectly to industry challenges LONDON, Dec. 10, 2013 /PRNewswire/ -- ...

Abstract: This work presents a dual-band coil module for near-field resonant wireless power transfer (WPT). It provides additional channel either for more power transfer or higher data transmission.

This project was created in order to allow a bluetooth communication between a Tesla Coil module and a ESP32 DevKit device. In adittion, the source code allows to play piano notes into the tesla coil ...

Infineon, a manufacturer of semiconductor solutions for payment applications, introduced its Coil on Module chip package to support global distribution of dual interface bank and credit cards. The new ...

Neubiberg, Germany – January 29, 2013 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a worldwide leading manufacturer of semiconductor solutions for payment applications, today introduced its ...

Infineon Technologies AG today announced the availability of its "Coil on Module" (CoM) package technology for official documents. The technology simplifies and improves manufacturing of electronic ...

Infineon is expanding its CoM (Coil on Module) portfolio for secure contactless ID documents. The new SLC52 security chip is now available, integrated with the card antenna into a polycarbonate ...