Abstract: The method of how to determine the thickness of Cu layer on wafer in CMP process is a key technology in advanced CMP unit, especially in the stress free polishing (SFP) process. In this new ...
Chemical Mechanical Planarization (CMP) is a critical process in the semiconductor, LED wafer, and hard disk manufacturing industry and is used to achieve the substrate wafer's required planarity.
Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...
Abstract: We have developed a CMP process providing a short polishing time and sufficient uniformity that is applicable to 300 mm scale carbon nanotube (CNT) via integration. To achieve our target, we ...
Faster computer and electronic processors require smaller features for integrated circuits (IC), which in turn require smaller and smoother substrate surfaces. Chemical mechanical polishing (CMP) has ...
Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW cross-contamination and back-flow can be optimised with the Malema Interconnect ...
Use of machine learning and feed-forward neural networks presents a new and exciting opportunity to develop high-accuracy CMP models of complex, advanced deposition processes. Machine learning (ML), ...
One definition of design for manufacturing (DFM) is providing knowledge about the impact of the manufacturing process on a design layout to the designers, so they can use that information to improve ...
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