Infineon Technologies AG has added a 62-mm module, designed in a half-bridge topology, to its CoolSiC MOSFET 1,200-V module family. Based on the trench chip technology, the new device opens up silicon ...
The proven 62 mm SiC module has been designed in half-bridge topology and is based on the trench chip technology. It opens up silicon carbide for applications in the medium power range starting at 250 ...
Built on the advanced 210 mm product technology platform, Trina Solar’s golden size modules featuring high power, high efficiency, high reliability and high energy yield with lower LCOE and covering ...
On November 27th, Trina Solar, Risen Energy, Zhonghuan Semiconductor, Tongwei, Huansheng Photovoltaic, Runyang New Energy Technology, Canadian Solar and Wuxi Shangji Automation jointly proposed ...
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