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Ubitium, a German semiconductor start-up, announced the tape-out of its first silicon on Samsung Foundry's 8nm process. The tape-out was completed in December 2025. The chip is the first universal ...

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The tape-out validates the foundational components of Ubitium's architecture: the Universal Processing Array with runtime ...

Ubitium, a German semiconductor start-up, announced the tape-out of its first silicon on Samsung Foundry's 8nm process. The tape-out was completed in December 2025. The chip is the first universal ...

Infosys Technologies Ltd has informed that Finacle, the universal banking solution from Infosys Technologies, on October 29, 2007 has announced the launch of Finacle Bank-in-a-Box (BIAB), a ...